Provided is a multilayer printed wiring board in which multiple via holes that connect a first power supply wiring with a second power supply wiring are aligned in a line in parallel to a direction along which current flows. In order to prevent current from being concentrated on the via hole connected to a farthest end of the power supply wiring among the via holes, a narrow portion between the via hole and the via hole is narrowed to increase a resistance. A narrow portion that is narrowed is disposed similarly at a farthest end of the power supply wiring of the second conductor layer.