Invention Grant
- Patent Title: Bonding device
- Patent Title (中): 粘接装置
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Application No.: US12207128Application Date: 2008-09-09
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Publication No.: US08168920B2Publication Date: 2012-05-01
- Inventor: Toru Terada , Eiji Tanaka , Yasuhisa Matsumoto , Keiichi Yamaoka
- Applicant: Toru Terada , Eiji Tanaka , Yasuhisa Matsumoto , Keiichi Yamaoka
- Applicant Address: JP Kanazawa-shi, Ishikawa-ken
- Assignee: Shibuya Kogyo Co., Ltd.
- Current Assignee: Shibuya Kogyo Co., Ltd.
- Current Assignee Address: JP Kanazawa-shi, Ishikawa-ken
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2007-235502 20070911; JPP2007-271725 20071018; JPP2008-020085 20080131
- Main IPC: B23K1/005
- IPC: B23K1/005 ; H01L21/60
Abstract:
A bonding device includes a bonding head including a bonding tool for sucking and holding an electronic component, and a laser heater for heating the electronic component by irradiating laser light on the electronic component held by the bonding tool from an inside of the bonding head, the laser heater including a collective unit for condensing laser light emitted from a light source. A focusing point of the laser light condensed by the collective unit is formed inside the bonding head.
Public/Granted literature
- US20090071945A1 BONDING DEVICE Public/Granted day:2009-03-19
Information query
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