Invention Grant
- Patent Title: Interface techniques for coupling a sensor to a readout circuit
- Patent Title (中): 用于将传感器耦合到读出电路的接口技术
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Application No.: US13162738Application Date: 2011-06-17
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Publication No.: US08168936B2Publication Date: 2012-05-01
- Inventor: Michael E. DeFlumere , Paul W. Schoeck
- Applicant: Michael E. DeFlumere , Paul W. Schoeck
- Applicant Address: US NH Nashua
- Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee Address: US NH Nashua
- Agency: Finch & Maloney PLLC
- Agent Neil F. Maloney
- Main IPC: H01J40/14
- IPC: H01J40/14

Abstract:
Techniques are disclosed that can be used to interface a sensor circuit with readout circuitry. The techniques can be employed, for instance, with microchannel plate (MCP) based devices used in numerous sensing/detection applications, and are particularly suitable for applications where it is desirable to interface an MCP having a relatively large active area to a readout circuit having a relatively smaller active area. The interface effectively decouples anode geometry from readout circuit geometry and also may be configured with flexible anode pad geometry, which allows for compensation of optical blur variations as well as a very high fill factor. The interface can be made using standard semiconductor materials and photolithography techniques and can be configured with thermal expansion qualities that closely track or otherwise match that of the readout circuitry.
Public/Granted literature
- US20110253881A1 Interface Techniques for Coupling a Sensor to a Readout Circuit Public/Granted day:2011-10-20
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