Invention Grant
- Patent Title: Light emitting diode package
- Patent Title (中): 发光二极管封装
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Application No.: US12192175Application Date: 2008-08-15
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Publication No.: US08168997B2Publication Date: 2012-05-01
- Inventor: Seong Ah Joo , Jung Kyu Park , Kun Yoo Ko , Young June Jeong , Seung Hwan Choi
- Applicant: Seong Ah Joo , Jung Kyu Park , Kun Yoo Ko , Young June Jeong , Seung Hwan Choi
- Applicant Address: KR Gyunggi-do
- Assignee: Samsung LED Co., Ltd.
- Current Assignee: Samsung LED Co., Ltd.
- Current Assignee Address: KR Gyunggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2007-0083886 20070821
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electrically connected to the PCB through the conductive structure.
Public/Granted literature
- US20090050923A1 LIGHT EMITTING DIODE PACKAGE Public/Granted day:2009-02-26
Information query
IPC分类:
