Invention Grant
- Patent Title: Semiconductor device and method of fabricating the semiconductor device
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US12247315Application Date: 2008-10-08
-
Publication No.: US08169012B2Publication Date: 2012-05-01
- Inventor: Yong-kug Bae , Si-hyeung Lee , Tae-hyuk Ahn , Seok-hwan Oh
- Applicant: Yong-kug Bae , Si-hyeung Lee , Tae-hyuk Ahn , Seok-hwan Oh
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2007-0106741 20071023
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/94

Abstract:
A semiconductor device and a method of fabricating a semiconductor device provide high quality cylindrical capacitors. The semiconductor device includes a substrate defining a cell region and a peripheral circuit region, a plurality of capacitors in the cell region, and supports for supporting lower electrodes of the capacitors. The lower electrodes are disposed in a plurality of rows each extending in a first direction. A dielectric layer is disposed on the lower electrodes, and an upper electrode is disposed on the dielectric layer. The supports are in the form of stripes extending longitudinally in the first direction and spaced from each other along a second direction. Each of the supports engages the lower electrodes of a respective plurality of adjacent rows of the lower electrodes. Each one of the supports is also disposed at a different level in the device from the support that is adjacent thereto in the second direction.
Public/Granted literature
- US20090102017A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE Public/Granted day:2009-04-23
Information query
IPC分类: