System and method for an improved interdigitated capacitive structure for an integrated circuit. A preferred embodiment comprises a first layer of a sequence of substantially parallel interdigitated strips, each strip of either a first polarity or a second polarity, the sequence alternating between a strip of the first polarity and a strip of the second polarity. A first dielectric layer is deposited over each strip of the first layer of strips. A first extension layer of a sequence of substantially interdigitated extension strips is deposited over the first dielectric layer, each extension strip deposited over a strip of the first layer of the opposite polarity. A first sequence of vias is coupled to the first extension layer, each via deposited over an extension strip of the same polarity. A second layer of a sequence of substantially parallel interdigitated strips can be coupled to the first sequence of vias.