Invention Grant
- Patent Title: Metal-oxide-semiconductor chip and fabrication method thereof
- Patent Title (中): 金属氧化物半导体芯片及其制造方法
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Application No.: US12556715Application Date: 2009-09-10
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Publication No.: US08169019B2Publication Date: 2012-05-01
- Inventor: Kuo-Chang Tsen , Kao-Way Tu
- Applicant: Kuo-Chang Tsen , Kao-Way Tu
- Applicant Address: TW Taipei
- Assignee: Niko Semiconductor Co., Ltd.
- Current Assignee: Niko Semiconductor Co., Ltd.
- Current Assignee Address: TW Taipei
- Agency: Kile Goekjian Reed & McManus PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A metal-oxide-semiconductor chip having a semiconductor substrate, an epitaxial layer, at least a MOS cell, and a metal pattern layer is provided. The epitaxial layer is located on the semiconductor substrate and has an active region, a termination region, and a scribe line preserving region defined on an upper surface thereof. An etched sidewall of the epitaxial layer is located in the scribe line preserving region. The boundary portion of the upper surface of the semiconductor substrate is thus exposed. The MOS cell is located in the active region. The metal pattern layer is located on the epitaxial layer and has a gate pad coupled to the gate of the MOS cell, a source pad coupled to the source of the MOS cell, and a drain pattern, which is partly located on the upper surface of the semiconductor substrate.
Public/Granted literature
- US20110057254A1 METAL-OXIDE-SEMICONDUCTOR CHIP AND FABRICATION METHOD THEREOF Public/Granted day:2011-03-10
Information query
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