Invention Grant
- Patent Title: Integrated circuit package assembly including wave guide
- Patent Title (中): 集成电路封装组件,包括波导
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Application No.: US12748709Application Date: 2010-03-29
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Publication No.: US08169060B2Publication Date: 2012-05-01
- Inventor: Linus Maurer , Alexander Reisenzahn , Markus Treml , Thomas Wickgruber
- Applicant: Linus Maurer , Alexander Reisenzahn , Markus Treml , Thomas Wickgruber
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L39/00
- IPC: H01L39/00 ; H01L23/52

Abstract:
Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.
Public/Granted literature
- US20110234472A1 Integrated Circuit Package Assembly Including Wave Guide Public/Granted day:2011-09-29
Information query
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