Invention Grant
- Patent Title: Semiconductor component and method for producing the same
- Patent Title (中): 半导体元件及其制造方法
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Application No.: US12408162Application Date: 2009-03-20
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Publication No.: US08169063B2Publication Date: 2012-05-01
- Inventor: Ralf Otremba , Josef Hoeglauer , Matthias Stecher
- Applicant: Ralf Otremba , Josef Hoeglauer , Matthias Stecher
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102006033319 20060717
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A semiconductor component of semiconductor chip size includes a semiconductor chip. The semiconductor chip has a metallic coating that completely covers the side edges, the rear side and the top side, on which surface-mountable external contacts are arranged. One embodiment includes power semiconductor components, wherein the metallic coating connects a rear side electrode to one of the surface-mountable external contacts on the top side of a power semiconductor chip.
Public/Granted literature
- US20090179311A1 SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING THE SAME Public/Granted day:2009-07-16
Information query
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