Invention Grant
- Patent Title: Semiconductor device and electronic apparatus of multi-chip packaging
- Patent Title (中): 半导体器件和电子设备的多芯片封装
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Application No.: US11457026Application Date: 2006-07-12
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Publication No.: US08169073B2Publication Date: 2012-05-01
- Inventor: Kei Murayama , Mitsutoshi Higashi
- Applicant: Kei Murayama , Mitsutoshi Higashi
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2005-206887 20050715
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
External connection terminals 27 which are electrically connected to semiconductor chips 11-1, 11-2, 12-1, 12-2 and also protrude beyond the semiconductor chips 11-1, 11-2, 12-1, 12-2 are disposed on a substrate 13 of the side to which the plural semiconductor chips 11-1, 11-2, 12-1, 12-2 are connected.
Public/Granted literature
- US20070013064A1 SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2007-01-18
Information query
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