Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12811770Application Date: 2009-01-07
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Publication No.: US08169087B2Publication Date: 2012-05-01
- Inventor: Masaru Senoo
- Applicant: Masaru Senoo
- Applicant Address: JP Toyota-shi
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Toyota-shi
- Agency: Kenyon & Kenyon LLP
- Priority: JP2008-002157 20080109
- International Application: PCT/IB2009/000014 WO 20090107
- International Announcement: WO2009/087561 WO 20090716
- Main IPC: H01L29/40
- IPC: H01L29/40
Abstract:
A protective coating is formed on the surface of a semiconductor device. The surface is located on the side to which an extension portion of a wire connected to a pad of the semiconductor device is pulled. The protective coating is formed such that its height decreases toward the pad.
Public/Granted literature
- US20100276817A1 SEMICONDUCTOR DEVICE Public/Granted day:2010-11-04
Information query
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