Invention Grant
- Patent Title: Metal patch antenna
- Patent Title (中): 金属贴片天线
-
Application No.: US12541725Application Date: 2009-08-14
-
Publication No.: US08169371B1Publication Date: 2012-05-01
- Inventor: Neil F. Chamberlain , Richard E. Hodges , Mark S. Zawadzki
- Applicant: Neil F. Chamberlain , Richard E. Hodges , Mark S. Zawadzki
- Applicant Address: US DC Washington
- Assignee: The United States of America, as represented by the Administrator of the National Aeronautics and Space Administrator
- Current Assignee: The United States of America, as represented by the Administrator of the National Aeronautics and Space Administrator
- Current Assignee Address: US DC Washington
- Agent Mark Homer
- Main IPC: H01Q1/24
- IPC: H01Q1/24

Abstract:
Disclosed herein is a patch antenna comprises a planar conductive patch attached to a ground plane by a support member, and a probe connector in electrical communication with the conductive patch arranged to conduct electromagnetic energy to or from the conductive patch, wherein the conductive patch is disposed essentially parallel to the ground plane and is separated from the ground plane by a spacing distance; wherein the support member comprises a plurality of sides disposed about a central axis oriented perpendicular to the conductive patch and the ground plane; wherein the conductive patch is solely supported above the ground plane by the support member; and wherein the support member provides electrical communication between the planer conductive patch and the ground plane.
Information query