Invention Grant
- Patent Title: Array substrate and method of manufacturing the same
- Patent Title (中): 阵列基板及其制造方法
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Application No.: US12364858Application Date: 2009-02-03
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Publication No.: US08169559B2Publication Date: 2012-05-01
- Inventor: Hwa-Sung Woo , Joo-Nyung Jang , Cheol Shin , Yoon-Sung Um , Mi-Jeong Song
- Applicant: Hwa-Sung Woo , Joo-Nyung Jang , Cheol Shin , Yoon-Sung Um , Mi-Jeong Song
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR2009-3560 20090116
- Main IPC: G02F1/1343
- IPC: G02F1/1343 ; G02F1/136

Abstract:
In an array substrate and a method of manufacturing the array substrate, an array substrate includes a first switching element, a second switching element, a third switching element and a fourth switching element. The first switching element is electrically connected to a first data line. The second switching element is electrically connected to a second data line adjacent to the first data line. The third switching element is electrically connected to a data power line interposed between the first and second data lines. The fourth switching element is electrically connected to a gate power line receiving a voltage having different polarity from a voltage applied to the data power line. Therefore, light transmittance, opening ratio and display quality are improved.
Public/Granted literature
- US20100182522A1 ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-07-22
Information query
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