Invention Grant
- Patent Title: ESD clamp circuit applied to power amplifier
- Patent Title (中): ESD钳位电路应用于功率放大器
-
Application No.: US12400799Application Date: 2009-03-10
-
Publication No.: US08169761B2Publication Date: 2012-05-01
- Inventor: Chih-Ting Yeh , Yung-Chih Liang , Shih-Hung Chen
- Applicant: Chih-Ting Yeh , Yung-Chih Liang , Shih-Hung Chen
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW97148269A 20081211
- Main IPC: H02H9/00
- IPC: H02H9/00

Abstract:
An ESD clamp circuit applied to a power amplifier is provided. The ESD clamp circuit includes a first line, a second line, a first circuit, a second circuit, an ESD detecting unit, a buffer unit, and an ESD clamp unit. The first line is coupled to the output terminal of the power amplifier. The first circuit is coupled to the first line. The second circuit is coupled to the first circuit. The ESD detecting unit is coupled to the first circuit and the second line. The buffer unit is coupled to the second circuit, the second line and the ESD detecting unit. The ESD clamp unit is coupled to the buffer unit, the first line and the second line. Therefore, at normal operation mode, the problem of signal loss caused by the leakage current of ESD clamp circuit can be avoided.
Public/Granted literature
- US20100149703A1 ESD CLAMP CIRCUIT APPLIED TO POWER AMPLIFIER Public/Granted day:2010-06-17
Information query