Invention Grant
- Patent Title: Power supply and heat dissipation module thereof
- Patent Title (中): 其电源和散热模块
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Application No.: US12754621Application Date: 2010-04-06
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Publication No.: US08169781B2Publication Date: 2012-05-01
- Inventor: Shao-Feng Lu
- Applicant: Shao-Feng Lu
- Applicant Address: TW Taoyuan, Taoyuan County TW Guishan Township, Taoyuan County
- Assignee: FSP Technology Inc.,3Y Power Technology (Taiwan), Inc.
- Current Assignee: FSP Technology Inc.,3Y Power Technology (Taiwan), Inc.
- Current Assignee Address: TW Taoyuan, Taoyuan County TW Guishan Township, Taoyuan County
- Agent Winston Hsu; Scott Margo
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00 ; F28F7/00
Abstract:
A power supply includes a casing, a printed circuit board (PCB) and a heat dissipation module. The PCB is disposed in the casing and has a heat-generating element. The casing has a top cover. The heat dissipation module includes a heatsink and a heat dissipation plate. The heatsink is disposed at the PCB and contacts the heat-generating elements. The heatsink has a surface facing the top cover. The heat dissipation plate is disposed between the heatsink and the top cover and contacts the surface of the heatsink.
Public/Granted literature
- US20110242766A1 POWER SUPPLY AND HEAT DISSIPATION MODULE THEREOF Public/Granted day:2011-10-06
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