Invention Grant
- Patent Title: Electronic device and fabrication method thereof
- Patent Title (中): 电子器件及其制造方法
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Application No.: US12911574Application Date: 2010-10-25
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Publication No.: US08169793B2Publication Date: 2012-05-01
- Inventor: Kenji Uchida
- Applicant: Kenji Uchida
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-245655 20091026
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/04

Abstract:
Provided is an electronic device of high reliability having an exposed functional portion. An electronic device 10 comprises an electronic element 11 having an exposed functional portion 11a on a first surface, a frame member 12 having a first penetration hole 12a, and a board 13 having a second penetration hole 13a. The frame member 12 is provided on the first surface of the electronic element 11 such that the first penetration hole 12a faces at least a part of the functional portion 11a. The electronic element 11 is mounted on the board 13 such that at least a part of the functional portion 11a faces the second penetration hole 13a. The frame member 12 does not contact with the board 13.
Public/Granted literature
- US20110096515A1 ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF Public/Granted day:2011-04-28
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