Invention Grant
- Patent Title: Forming multiprocessor systems using dual processors
- Patent Title (中): 形成使用双处理器的多处理器系统
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Application No.: US12430242Application Date: 2009-04-27
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Publication No.: US08169850B2Publication Date: 2012-05-01
- Inventor: Krishnakanth Sistla , Ganapati Srinivasa
- Applicant: Krishnakanth Sistla , Ganapati Srinivasa
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G11C8/00
- IPC: G11C8/00 ; G06F13/00 ; G06F1/12
Abstract:
In one embodiment, link logic of a multi-chip processor (MCP) formed using multiple processors may interface with a first point-to-point (PtP) link coupled between the MCP and an off-package agent and another PtP link coupled between first and second processors of the MCP, where the on-package PtP link operates at a greater bandwidth than the first PtP link. Other embodiments are described and claimed.
Public/Granted literature
- US20100274975A1 Forming Multiprocessor Systems Using Dual Processors Public/Granted day:2010-10-28
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