An integrated circuit (IC) includes a die and a package substrate. The die includes circuit modules and an RF bus transceiver module and the package substrate includes a micro-electromechanical (MEM) area. The RF bus transceiver module includes a baseband processing module, a transmitter section, a receiver section, a transformer, an impedance matching circuit, and a transmission line. At least one of the transformer, the impedance matching circuit, and the transmission line is within the MEM area.