Invention Grant
- Patent Title: Multi-layer stack platform for cloud communications
- Patent Title (中): 用于云通信的多层堆栈平台
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Application No.: US13014919Application Date: 2011-01-27
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Publication No.: US08171160B1Publication Date: 2012-05-01
- Inventor: John Ward , Haydar Haba
- Applicant: John Ward , Haydar Haba
- Applicant Address: US CA San Mateo
- Assignee: IntelePeer, Inc.
- Current Assignee: IntelePeer, Inc.
- Current Assignee Address: US CA San Mateo
- Agency: DLA Piper LLP (US)
- Main IPC: G06F15/173
- IPC: G06F15/173 ; G06F15/16 ; H04L12/28

Abstract:
A multi-layer stack platform is provided for cloud communication connections and services between devices. The system includes three or more layers, including a directory component, an applications component, and a peering component. An interconnection component may also be provided for communication between the applications component and the peering component. The components operate to provide communication services, such as sessions, according to the functionality of a selected application by adhering to device, user, and routing rules and preferences. The device, user, and routing rules and preferences are maintained in and processed by the directory component. The applications component receives communication session requests and accesses corresponding application scripts to perform the requested session. The peering component receives the device, user, and routing rules and preferences, and establishes connection between devices based on the rules and preferences as defined by the directory component.
Public/Granted literature
- US20120102208A1 MULTI-LAYER STACK PLATFORM FOR CLOUD COMMUNICATIONS Public/Granted day:2012-04-26
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