Invention Grant
- Patent Title: Method of manufacturing liquid ejecting head
- Patent Title (中): 液体喷头的制造方法
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Application No.: US12853163Application Date: 2010-08-09
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Publication No.: US08171635B2Publication Date: 2012-05-08
- Inventor: Hiroyuki Kobayashi , Katsuhiro Okubo , Kazuhide Nakamura , Nobuyoshi Uji
- Applicant: Hiroyuki Kobayashi , Katsuhiro Okubo , Kazuhide Nakamura , Nobuyoshi Uji
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick, Townsend & Stockton LLP
- Priority: JP2009-185499 20090810
- Main IPC: B21D53/76
- IPC: B21D53/76 ; B23P17/00 ; B41J2/015

Abstract:
A method of manufacturing a liquid ejecting head is disclosed. The head includes first and second supply members forming parts of a liquid supply passage. The liquid ejecting head includes a filter disposed between the first and second supply members so as to cross the liquid supply passage, and an integrally molded member fixing the first and second supply members by a resin in a state where the filter is nipped between the first and second supply members. The method includes: disposing the filter in one of the first and second supply members; nipping the filter by the first and second supply members in a state where the filter is sucked, adsorbed, and positioned via a suction hole of the first or second supply member; and forming the integrally molded member in the state where the filter is nipped between the first and second supply members.
Public/Granted literature
- US20110030216A1 METHOD OF MANUFACTURING LIQUID EJECTING HEAD Public/Granted day:2011-02-10
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