Invention Grant
- Patent Title: Method for cutting a brittle material
- Patent Title (中): 切割脆性材料的方法
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Application No.: US12621068Application Date: 2009-11-18
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Publication No.: US08171753B2Publication Date: 2012-05-08
- Inventor: Anatoli A. Abramov , Weiwei Luo
- Applicant: Anatoli A. Abramov , Weiwei Luo
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Kevin M. Able
- Main IPC: C03B33/09
- IPC: C03B33/09
Abstract:
A method of scoring and/or separating a brittle material is described comprising heating a surface of the brittle material along a predetermined path with a laser, then quenching the heated surface with a stream of cooling liquid, such as water, formed by a nozzle. The portion of the cooling stream impinging on the surface of the brittle material is a substantially columnar flow.
Public/Granted literature
- US20110113830A1 METHOD FOR CUTTING A BRITTLE MATERIAL Public/Granted day:2011-05-19
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