Invention Grant
US08171880B2 Microwave plasma processing apparatus and method of supplying microwaves using the apparatus
有权
微波等离子体处理装置及使用该装置提供微波的方法
- Patent Title: Microwave plasma processing apparatus and method of supplying microwaves using the apparatus
- Patent Title (中): 微波等离子体处理装置及使用该装置提供微波的方法
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Application No.: US12487164Application Date: 2009-06-18
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Publication No.: US08171880B2Publication Date: 2012-05-08
- Inventor: Shinya Nishimoto
- Applicant: Shinya Nishimoto
- Applicant Address: JP
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP
- Agency: Cantor Colburn LLP
- Priority: JP2008-159629 20080618
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306

Abstract:
A microwave plasma processing apparatus performs plasma processing on a substrate by exciting a gas by electric field energy of microwaves emitted from a radial line slot antenna (RLSA). The microwave plasma processing apparatus includes: a processing container in which plasma processing is performed; a microwave source outputting microwaves; a rectangular waveguide transmitting the microwaves outputted from the microwave source; a coaxial converter converting a mode of the microwaves transmitted to the rectangular waveguide; a coaxial waveguide including an inner conductor slidably and electrically connected to the coaxial converter by a first contact member; the first contact member fixed to the coaxial converter and slidably contacting the inner conductor; and a first spring member absorbing displacement, which is caused by thermal expansion, of the RLSA and a member disposed above the RLSA.
Public/Granted literature
- US20090317566A1 MICROWAVE PLASMA PROCESSING APPARATUS AND METHOD OF SUPPLYING MICROWAVES USING THE APPARATUS Public/Granted day:2009-12-24
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