Invention Grant
- Patent Title: Fluid filled type vibration damping device
- Patent Title (中): 流体填充式减震装置
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Application No.: US12232515Application Date: 2008-09-18
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Publication No.: US08172209B2Publication Date: 2012-05-08
- Inventor: Mutsumi Muraoka
- Applicant: Mutsumi Muraoka
- Applicant Address: JP Komaki
- Assignee: Tokai Rubber Industries, Ltd.
- Current Assignee: Tokai Rubber Industries, Ltd.
- Current Assignee Address: JP Komaki
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-246119 20070921; JP2007-337015 20071227
- Main IPC: F16F5/00
- IPC: F16F5/00

Abstract:
A vibration damping device including: a rubber elastic body connecting first and second mounting members; a partition member supported on the second mounting member; a pressure-receiving chamber and an equilibrium chamber connected by a first orifice passage; an oscillating plate defining the pressure-receiving chamber; and an electromagnetic actuator for actuating the oscillating plate. The oscillating plate is constituted by a cylinder shaped hole and a piston shaped plate accommodated within the cylinder shaped hole with a gap provided therebetween. An output member of the electromagnetic actuator is linked to the piston shaped plate. A plate spring extending in an axis-perpendicular direction is disposed to an opposite side from the electromagnetic actuator with the piston shaped plate therebetween, with the oscillating plate linked to and supported in an axial direction with respect to the partition member by the plate spring.
Public/Granted literature
- US20090079114A1 Fluid filled type vibration damping device Public/Granted day:2009-03-26
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