Invention Grant
- Patent Title: Printhead servicing system and method
- Patent Title (中): 打印头维修系统和方法
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Application No.: US12257727Application Date: 2008-10-24
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Publication No.: US08172360B2Publication Date: 2012-05-08
- Inventor: Chiok Liang Tay , Kok Weng Chan
- Applicant: Chiok Liang Tay , Kok Weng Chan
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J1/165
- IPC: B41J1/165

Abstract:
A system for servicing a printhead having a plurality of orifices formed in a face thereof includes a cap configured to mate with the face of the printhead; a porous material provided in the cap, wherein the porous material has a first side arranged to face the face of the printhead and a second side opposite the first side; and a vacuum communicated with the cap, wherein the vacuum is configured to draw fluid from the orifices of the printhead through the porous material provided in the cap. The second side of the porous material has a recess formed therein such that the vacuum is communicated with the recess.
Public/Granted literature
- US20090213170A1 Printhead Servicing System And Method Public/Granted day:2009-08-27
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