The light emitting module 11 includes: a mount body 20; and a support body 30 supporting the mount body 20. The mount body 20 includes: a circuit board 21 with wirings provided thereon; and a light emitting unit 40 to be mounted on the circuit board 21. The circuit board 21 includes: a base portion 22; and a rising portion 23, with the light emitting unit 40 being attached thereon, rising from one end, in a longitudinal direction, of the base portion 22 through a bending portion 24. The rising portion 23 is divided into seven, first to seventh sidewall portions 23a to 23g with slits 25a to 25f provided at six positions. First to seventh light emitting portions 40a to 40g forming the light emitting unit 40 are attached to the first to seventh sidewall portions 23a to 23g, respectively. Thereby, reduction in thickness of a light emitting device including solid-state light emitting elements is achieved.