An optoelectronic interconnection module capable of performing optical signal transmission and electrical signal transmission, including a flexible optoelectronic interconnection board including an optical interconnection path, electrical wires and electrical connection terminals used for electrically connecting the electrical wires to an exterior at an end portion thereof, an optical semiconductor device mounted on a portion near one-end of the flexible optoelectronic interconnection board, and a bend portion provided in a lengthwise direction of the flexible optoelectronic interconnection board in parallel to a mounting region of the optical semiconductor device.