A socket structure stack and a socket structure thereof are provided. The socket structure stack includes at least two socket structures, and each socket structure includes a main body, a plurality of conductive elements, and a plurality of connecting elements. The main body includes an inner plate and an outer plate, wherein the inner plate has a receiving portion and an embedded portion. The conductive elements are embedded in the embedded portion, and the connecting elements are mounted on the outer plate so as to connect adjacent socket structures together. The socket structures are so configured that ICs, processors, and printed circuit boards connected to the socket structures or the socket structures themselves can be recycled. Moreover, the printed circuit boards can be easily assembled to the socket structures, and the socket structures can be stacked up and securely connected to form a 3D structure which is otherwise difficult to put together by soldering.