Invention Grant
US08172624B2 Wiring device assembly with contact stabilizing structure 有权
具有接触稳定结构的接线装置组件

  • Patent Title: Wiring device assembly with contact stabilizing structure
  • Patent Title (中): 具有接触稳定结构的接线装置组件
  • Application No.: US12314248
    Application Date: 2008-12-05
  • Publication No.: US08172624B2
    Publication Date: 2012-05-08
  • Inventor: Patrick J. Tiberio, Jr.
  • Applicant: Patrick J. Tiberio, Jr.
  • Applicant Address: US CT Shelton
  • Assignee: Hubbell Incorporated
  • Current Assignee: Hubbell Incorporated
  • Current Assignee Address: US CT Shelton
  • Agent Kevin M. Barner; Mark S. Bicks; Alfred N. Goodman
  • Main IPC: H01R13/40
  • IPC: H01R13/40
Wiring device assembly with contact stabilizing structure
Abstract:
A wiring device assembly with one or more electrical contacts having respective contact stabilizing assemblies which are operable to rigidly hold the electrical contacts in a device housing. The contact stabilizing assemblies prevent the contacts from becoming displaced within the housing under vibrational, rotational and other stresses. The contact stabilizing assemblies are connected to the electrical contacts and fit in housing channels specifically shaped to accommodate the stabilizing assemblies.
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