Invention Grant
- Patent Title: Joint implant placement
- Patent Title (中): 关节植入放置
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Application No.: US12407031Application Date: 2009-03-19
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Publication No.: US08172775B2Publication Date: 2012-05-08
- Inventor: Blaine Warkentine , Björn Spies
- Applicant: Blaine Warkentine , Björn Spies
- Applicant Address: DE Feldkirchen
- Assignee: Brainlab AG
- Current Assignee: Brainlab AG
- Current Assignee Address: DE Feldkirchen
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: EP08153031 20080319; EP08154210 20080408
- Main IPC: A61B5/103
- IPC: A61B5/103 ; A61B5/117

Abstract:
Method for planning implant placement, the implant comprising a first implant in a first limb and a second implant in a second limb, the first and the second implant forming an artificial structure joining the first and second limb, the method comprising the steps: a) providing a first limb data set representing a first reference system in which the first limb is fixed; b) providing a second limb data set representing a second reference system in which the second limb is fixed; c) providing a representation of the implant for the head of the second limb in a known position in the second reference system; d) providing relative pose data representing a plurality of different relative positions and/or orientations, referred to as relative poses, of the first and second reference system; e) determining a data set representing a plurality of envelope points, said envelope points being generated by calculating the locations of a point of the second implant representation in the first reference system for the plurality of relative poses; and f) placing a representation of the first implant in the first reference system by adjusting and/or matching pose of the representation of the first implant to the plurality of envelope points.
Public/Granted literature
- US20090240169A1 JOINT IMPLANT PLACEMENT Public/Granted day:2009-09-24
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