A thermal pack having a bent lip uniformly disposed away from a skin side of the thermal pack. The thermal pack of the present invention eliminates discomfort associated with prior art thermal packs by providing a lip that bends up and away from the skin, thereby avoiding or minimizing contact with the skin and limiting irritation. The pack is preferably provided with an insulated wrap 90 that can be attached to the pack, such as by a hook-and-loop fastener. The wrap will aid in placement of the device upon the user, as well as extend the benefits of the thermal medium. The wrap is conventionally formed of a thermoplastic material commonly used in packaging.