Invention Grant
- Patent Title: Expandable stent
- Patent Title (中): 可扩展支架
-
Application No.: US11745877Application Date: 2007-05-08
-
Publication No.: US08172893B2Publication Date: 2012-05-08
- Inventor: Brian E. Moore
- Applicant: Brian E. Moore
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: A61F2/90
- IPC: A61F2/90

Abstract:
A stent has a porous surface having a repeating pattern generally in the shape of a “butterfly” comprising alternative concave and convex segments which give the stent good flexibility when unexpanded, and good shape retention once expanded.
Public/Granted literature
- US20080119926A1 Expandable Stent Public/Granted day:2008-05-22
Information query
IPC分类: