Invention Grant
- Patent Title: Substrate processing apparatus and attaching/detaching method of reaction vessel
- Patent Title (中): 基板处理装置和反应容器的附着/拆卸方法
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Application No.: US11902154Application Date: 2007-09-19
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Publication No.: US08172947B2Publication Date: 2012-05-08
- Inventor: Koji Shibata , Masahiro Tatta
- Applicant: Koji Shibata , Masahiro Tatta
- Applicant Address: JP Tokyo
- Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee: Hitachi Kokusai Electric Inc.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-258660 20060925
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/44 ; C23C16/46 ; B21D39/00 ; B01J19/00 ; H01L21/00 ; H01L21/02 ; H01L21/205 ; H01L21/22 ; H01L21/31 ; F28D21/00 ; F27D1/18

Abstract:
To provide a substrate processing apparatus, comprising: a reaction vessel having a processing chamber inside that processes a substrate; a heating device that heats said substrate from an outer peripheral side of the reaction vessel; a lid member that closes the processing chamber; an attachment/detachment jig placed on the lid member for attaching/detaching the reaction vessel from an inside of the heating device; and a support section provided in an upper side of a lower end of the reaction vessel on an inside wall of the reaction vessel, and abutted on an upper surface of the attachment/detachment jig for attaching/detaching the reaction vessel from the inside of the heating device.
Public/Granted literature
- US20080083109A1 Substrate processing apparatus and attaching/detaching method of reaction vessel Public/Granted day:2008-04-10
Information query
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