Invention Grant
US08172979B2 Porous adhesive for corrugated cardboard and method of manufacturing corrugated cardboard using the same
有权
用于瓦楞纸板的多孔粘合剂以及使用其制造瓦楞纸板的方法
- Patent Title: Porous adhesive for corrugated cardboard and method of manufacturing corrugated cardboard using the same
- Patent Title (中): 用于瓦楞纸板的多孔粘合剂以及使用其制造瓦楞纸板的方法
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Application No.: US11965360Application Date: 2007-12-27
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Publication No.: US08172979B2Publication Date: 2012-05-08
- Inventor: Soosung Kim
- Applicant: Soosung Kim
- Agency: Frost Brown Todd LLC
- Priority: KR10-2007-0040766 20070426
- Main IPC: C09J4/00
- IPC: C09J4/00 ; C09J101/00 ; C09J201/00 ; B31F1/20 ; C08K3/34 ; B32B7/12

Abstract:
Disclosed is a porous adhesive for corrugated cardboard, including sticky starch and porous zeolite, in which microscopic holes to be joined with the microscopic holes in zeolite are formed in starch, thereby maintaining the freshness of food products stored in a corrugated cardboard box and efficiently eliminating remaining agricultural chemical components. Also, a method of manufacturing corrugated cardboard using the porous adhesive is provided. The porous adhesive for corrugated cardboard is obtained by blending a mixture, including 68.5˜79.5 wt % corn starch, 20˜30 wt % zeolite powder having the same particle size to that of the corn starch, and 0.5˜2 wt % microorganism-containing yellow soil, caustic soda and a hardener, with water. The zeolite powder and the corn starch have a particle size of 300˜350 meshes. The microorganisms contained in yellow soil are selected from the group consisting of Bacillus sp., Acinetobacter sp., Pseudomonas sp., and mixtures thereof.
Public/Granted literature
- US20080268224A1 POROUS ADHESIVE FOR CORRUGATED CARDBOARD AND METHOD OF MANUFACTURING CORRUGATED CARDBOARD USING THE SAME Public/Granted day:2008-10-30
Information query
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