Invention Grant
- Patent Title: Composition for circuit connection film and circuit connection film using the same
- Patent Title (中): 电路连接薄膜和电路连接薄膜的组成
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Application No.: US12654122Application Date: 2009-12-10
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Publication No.: US08173048B2Publication Date: 2012-05-08
- Inventor: Hyun Hee Namkung , Kyoung Soo Park , Bong Yong Kim , Kang Bae Yoon , Sang Sik Bae , Hyun Joo Seo
- Applicant: Hyun Hee Namkung , Kyoung Soo Park , Bong Yong Kim , Kang Bae Yoon , Sang Sik Bae , Hyun Joo Seo
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: Cheil Industries, Inc.
- Current Assignee: Cheil Industries, Inc.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2008-0126167 20081211
- Main IPC: H01B1/04
- IPC: H01B1/04 ; H01B1/02 ; H01B1/22 ; C08F26/02 ; C08G65/32
Abstract:
A composition for a circuit connection film and a circuit connection film using the same, the composition including a binder resin including an acrylate modified urethane resin, a carboxyl modified acrylonitrile butadiene rubber, and an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group, and an organic peroxide.
Public/Granted literature
- US20100148130A1 Composition for circuit connection film and circuit connection film using the same Public/Granted day:2010-06-17
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