Invention Grant
US08173050B2 Conductive pattern formation ink, conductive pattern and wiring substrate
失效
导电图案形成墨水,导电图案和布线基板
- Patent Title: Conductive pattern formation ink, conductive pattern and wiring substrate
- Patent Title (中): 导电图案形成墨水,导电图案和布线基板
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Application No.: US12331687Application Date: 2008-12-10
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Publication No.: US08173050B2Publication Date: 2012-05-08
- Inventor: Naoyuki Toyoda , Toshiyuki Kobayashi , Sachiko Endo , Noboru Uehara , Akihiko Tsunoya
- Applicant: Naoyuki Toyoda , Toshiyuki Kobayashi , Sachiko Endo , Noboru Uehara , Akihiko Tsunoya
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2007-320244 20071211
- Main IPC: H01B1/20
- IPC: H01B1/20

Abstract:
A conductive pattern formation ink which can be stably ejected in the form of liquid droplets and form a conductive pattern having high reliability, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern by ejecting the ink in the form of liquid droplets on a surface of a ceramic molded body using a liquid droplet ejecting method, the ceramic molded body being made of a material containing ceramic particles and a binder. The ink contains a water-based dispersion medium, and metal particles dispersed in the water-based dispersion medium, wherein the water-based dispersion medium contains oxygen molecules and nitrogen molecules, and wherein when the water-based dispersion medium is analyzed using a gas chromatography method, a total amount of the oxygen and nitrogen molecules contained in the water-based dispersion medium is 12 ppm or less.
Public/Granted literature
- US20090145638A1 CONDUCTIVE PATTERN FORMATION INK, CONDUCTIVE PATTERN AND WIRING SUBSTRATE Public/Granted day:2009-06-11
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