Invention Grant
US08173053B2 White heat-curable silicone resin composition and optoelectronic part case
有权
白色可热固化硅树脂组合物和光电子部件
- Patent Title: White heat-curable silicone resin composition and optoelectronic part case
- Patent Title (中): 白色可热固化硅树脂组合物和光电子部件
-
Application No.: US12480129Application Date: 2009-06-08
-
Publication No.: US08173053B2Publication Date: 2012-05-08
- Inventor: Yusuke Taguchi , Junichi Sawada
- Applicant: Yusuke Taguchi , Junichi Sawada
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch LLP
- Priority: JP2008-150328 20080609; JP2008-150356 20080609
- Main IPC: B29D11/00
- IPC: B29D11/00 ; C08L83/04 ; C08L83/06
Abstract:
A white heat-curable silicone resin composition comprising (A) a heat-curable organopolysiloxane, (B) a white pigment, (C) an inorganic filler, and (D) a condensation catalyst cures into a white uniform product having heat resistance, light resistance and minimal yellowing. The cured composition has a thermal conductivity of 1-10 W/mK. The composition is useful for forming cases on optoelectronic parts, typically LED.
Public/Granted literature
- US20090306263A1 WHITE HEAT-CURABLE SILICONE RESIN COMPOSITION AND OPTOELECTRONIC PART CASE Public/Granted day:2009-12-10
Information query
