Invention Grant
US08173267B2 Functionalization of poly(arylenevinylene) polymers for integrated circuits
有权
用于集成电路的聚(亚芳基亚乙烯基)聚合物的官能化
- Patent Title: Functionalization of poly(arylenevinylene) polymers for integrated circuits
- Patent Title (中): 用于集成电路的聚(亚芳基亚乙烯基)聚合物的官能化
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Application No.: US12026385Application Date: 2008-02-05
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Publication No.: US08173267B2Publication Date: 2012-05-08
- Inventor: Laurence Lutsen , Dirk Vandezande , Fateme Banishoeib
- Applicant: Laurence Lutsen , Dirk Vandezande , Fateme Banishoeib
- Applicant Address: BE Leuven BE Diepenbeek
- Assignee: IMEC,Universiteit Hasselt
- Current Assignee: IMEC,Universiteit Hasselt
- Current Assignee Address: BE Leuven BE Diepenbeek
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: EP07447045 20070801
- Main IPC: B32B27/28
- IPC: B32B27/28 ; C08F8/34

Abstract:
A method is provided for modifying a poly(arylene vinylene) or poly(heteroarylene vinylene) precursor polymer having dithiocarbamate moieties by reacting it with an acid and further optionally reacting the acid-modified polymer with a nucleophilic agent. Also provided are novel polymers and copolymers bearing nucleophilic side groups which are useful as components of electronic devices, e.g. in the form of thin layers.
Public/Granted literature
- US20090035597A1 FUNCTIONALIZATION OF POLY(ARYLENEVINYLENE) POLYMERS FOR INTEGRATED CIRCUITS Public/Granted day:2009-02-05
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