The purpose of the present invention is to provide a method for transferring a pattern of a circuit pattern precursor formed of electroconductive particles containing no resin component onto an objective substrate with high transfer efficiency while retaining a pattern shape. A method of transferring the circuit pattern precursor formed from an conductive particle dispersed solution on a dielectric thin film body includes the steps of: temporarily removing a liquid film remaining around the circuit pattern precursor right after a development step; subsequently re-electrifying the electroconductive particle pattern by supplying a solvent again to the circuit pattern precursor; and then electrostatically transferring the pattern onto the objective substrate through electrophoresis in the solvent.