Invention Grant
- Patent Title: Method of forming pattern and composition for forming of organic thin-film for use therein
- Patent Title (中): 形成用于形成有机薄膜的图案和组合物的方法
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Application No.: US12305893Application Date: 2007-06-21
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Publication No.: US08173348B2Publication Date: 2012-05-08
- Inventor: Daisuke Shimizu , Hikaru Sugita , Nobuji Matsumura , Toshiyuki Kai , Tsutomu Shimokawa
- Applicant: Daisuke Shimizu , Hikaru Sugita , Nobuji Matsumura , Toshiyuki Kai , Tsutomu Shimokawa
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2006-177034 20060627; JP2006-268671 20060929
- International Application: PCT/JP2007/062538 WO 20070621
- International Announcement: WO2008/001679 WO 20080103
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004 ; G03F7/075 ; G03F7/40
Abstract:
A method for forming a pattern contains (1) a step of forming an underlayer film containing (A) a radiation-sensitive acid generator capable of generating an acid upon exposure to radiation rays or (B) a radiation-sensitive base generator capable of generating a base upon exposure to radiation rays on a substrate; (2) a step of irradiating the underlayer film with radiation rays through a mask with a predetermined pattern to obtain an exposed underlayer film portion having been selectively exposed through the predetermined pattern; (3) a step of forming (C) an organic thin film on the underlayer film so as to attain chemical bonding of the exposed underlayer film portion with the organic thin-film formed on the exposed underlayer film portion; and (4) a step of removing the organic thin film formed on areas of the underlayer film other than the exposed underlayer film portion.
Public/Granted literature
- US20100233635A1 METHOD OF FORMING PATTERN AND COMPOSITION FOR FORMING OF ORGANIC THIN-FILM FOR USE THEREIN Public/Granted day:2010-09-16
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