Invention Grant
US08173349B2 Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device
有权
感光树脂组合物，高分子化合物，形成图案的方法和电子器件
- Patent Title: Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device
- Patent Title (中): 感光树脂组合物，高分子化合物，形成图案的方法和电子器件
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Application No.: US12410468Application Date: 2009-03-25
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Publication No.: US08173349B2Publication Date: 2012-05-08
- Inventor: Masanori Hikita , Yasufumi Ooishi , Kenichiro Sato
- Applicant: Masanori Hikita , Yasufumi Ooishi , Kenichiro Sato
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: SOLARIS Intellectual Property Group, PLLC
- Priority: JP2008-247883 20080926
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004 ; B14J2/16 ; C08J3/28
Abstract:
A polymer compound is provided which is excellent in heat resistance and insulating property, and a photosensitive resin composition is provided which includes the polymer compound, and may form a cured pattern or a cured film excellent in pattern forming property, resolution, heat resistance and insulating property. Also, a method for forming a cured pattern excellent in pattern forming property, resolution, heat resistance and insulating property using the photosensitive resin composition, and an electronic device having high reliance for a semiconductor device or for a display device are provided. The photosensitive resin composition includes a polymer compound obtained by reacting a monomer represented by Formula (1) and a monomer represented by Formula (2), and a photosensitizing agent.
Public/Granted literature
- US20100080963A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMER COMPOUND, METHOD OF FORMING A PATTERN, AND ELECTRONIC DEVICE Public/Granted day:2010-04-01
Information query
