Invention Grant
- Patent Title: Compound and radiation-sensitive composition
- Patent Title (中): 化合物和辐射敏感组合物
-
Application No.: US12519519Application Date: 2008-01-08
-
Publication No.: US08173351B2Publication Date: 2012-05-08
- Inventor: Daisuke Shimizu , Ken Maruyama , Toshiyuki Kai , Tsutomu Shimokawa
- Applicant: Daisuke Shimizu , Ken Maruyama , Toshiyuki Kai , Tsutomu Shimokawa
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Ditthavong Mori & Steiner, P.C.
- Priority: JP2007-001561 20070109; JP2007-054464 20070305; JP2007-209882 20070810
- International Application: PCT/JP2008/050083 WO 20080108
- International Announcement: WO2008/084786 WO 20080717
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/004 ; C07C39/08 ; C07C39/17 ; C07C65/01
Abstract:
A compound shown by the following formula (1) can be used as a material for a radiation-sensitive composition capable of forming a resist film which effectively responds to electron beams or the like, exhibits low roughness, and can form a high precision minute pattern in a stable manner.
Public/Granted literature
- US20090274977A1 COMPOUND AND RADIATION-SENSITIVE COMPOSITION Public/Granted day:2009-11-05
Information query
IPC分类:
