Invention Grant
- Patent Title: Method of producing an integrated micromagnet sensor assembly
- Patent Title (中): 一体化微型磁传感器组件的制造方法
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Application No.: US12642968Application Date: 2009-12-21
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Publication No.: US08173446B2Publication Date: 2012-05-08
- Inventor: William Hullinger Huber
- Applicant: William Hullinger Huber
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of integrating a permanent bias magnet within a magnetoresistance sensor comprising depositing an alternating pattern of a metal material and a semiconductor material on or within a surface of an insulating substrate; depositing a mask on the surface of the insulating substrate to create an opening above the alternating pattern of metal material and semiconductor material; applying a magnetic paste within the opening above the alternating pattern of metal material and semiconductor material; curing the magnetic paste to form a hardened bias magnet; removing the mask; and magnetizing the hardened bias magnet by applying a strong magnetic field to the hardened bias magnet at a desired orientation.
Public/Granted literature
- US20110151587A1 METHOD OF PRODUCING AN INTEGRATED MICROMAGNET SENSOR ASSEMBLY Public/Granted day:2011-06-23
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