Invention Grant
- Patent Title: Fabrication of electronic devices including flexible electrical circuits
- Patent Title (中): 包括柔性电路的电子设备的制造
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Application No.: US13008338Application Date: 2011-01-18
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Publication No.: US08173490B2Publication Date: 2012-05-08
- Inventor: Helmut Eckhardt , Stefan Ufer
- Applicant: Helmut Eckhardt , Stefan Ufer
- Agency: The Eclipse Group, LLP.
- Agent David P. Gloekler
- Main IPC: H01L21/768
- IPC: H01L21/768
Abstract:
A packaged electronic device includes a die, a flexible circuit structure, and a barrier film disposed on the die. The die includes die circuitry and electrical contacts. The flexible circuit structure is bonded directly to the die, and includes electrical conductors encapsulated by structural layers. Each electrical conductor contacts a respective electrical contact. The electronic device is encapsulated by the barrier film and one or more of the structural layers.
Public/Granted literature
- US20110117703A1 FABRICATION OF ELECTRONIC DEVICES INCLUDING FLEXIBLE ELECTRICAL CIRCUITS Public/Granted day:2011-05-19
Information query
IPC分类:
