Invention Grant
- Patent Title: Semiconductor on insulator
- Patent Title (中): 半导体绝缘体
-
Application No.: US12911649Application Date: 2010-10-25
-
Publication No.: US08173495B2Publication Date: 2012-05-08
- Inventor: Been-Yih Jin , Reza Arghavani , Robert Chau
- Applicant: Been-Yih Jin , Reza Arghavani , Robert Chau
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method and apparatus for producing a relatively thin, relatively uniform semiconductor layer which has improved carrier mobility. In an embodiment, a lattice-matched insulator layer is formed on a semiconductor substrate, and a lattice-matched semiconductor layer is formed on the insulator layer to form a relatively thin, relatively uniform semiconductor on insulator apparatus. In embodiments of the method and apparatus, energy band characteristics may be used to facilitate the extraction of the well-region minority carriers.
Public/Granted literature
- US20110039377A1 Semiconductor on Insulator Public/Granted day:2011-02-17
Information query
IPC分类: