Invention Grant
- Patent Title: Method for manufacturing semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US13024360Application Date: 2011-02-10
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Publication No.: US08173496B2Publication Date: 2012-05-08
- Inventor: Sho Kato , Satoshi Toriumi , Fumito Isaka , Hideto Ohnuma
- Applicant: Sho Kato , Satoshi Toriumi , Fumito Isaka , Hideto Ohnuma
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2008-149716 20080606
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/336 ; H01L21/30

Abstract:
A stack including at least an insulating layer, a first electrode, and a first impurity semiconductor layer is provided over a supporting substrate; a first semiconductor layer to which an impurity element imparting one conductivity type is added is formed over the first impurity semiconductor layer; a second semiconductor layer to which an impurity element imparting the one conductivity type is added is formed over the first semiconductor layer under a condition different from that of the first semiconductor layer; crystallinity of the first semiconductor layer and crystallinity of the second semiconductor layer are improved by a solid-phase growth method to form a second impurity semiconductor layer; an impurity element imparting the one conductivity type and an impurity element imparting a conductivity type different from the one conductivity type are added to the second impurity semiconductor layer; and a gate electrode layer is formed via a gate insulating layer.
Public/Granted literature
- US20110129969A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2011-06-02
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