Method for manufacturing semiconductor device

Invention Grant

US08173515B2 Method for manufacturing semiconductor device 失效

Title translation: 制造半导体器件的方法

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Patent Title: Method for manufacturing semiconductor device
Patent Title (中): 制造半导体器件的方法
Application No.: US12497315

Application Date: 2009-07-02
Publication No.: US08173515B2

Publication Date: 2012-05-08
Inventor: Toshiya Nakamori , Hiroshi Kujirai
Applicant: Toshiya Nakamori , Hiroshi Kujirai
Applicant Address: JP Tokyo
Assignee: Elpida Memory, Inc.
Current Assignee: Elpida Memory, Inc.
Current Assignee Address: JP Tokyo
Agency: Morrison & Foerster LLP
Priority: JP2008-188489 20080722
Main IPC: H01L21/762
IPC: H01L21/762

Method for manufacturing semiconductor device

Abstract:

An oxide film and a liner film are formed on an inner wall of a trench in a semiconductor substrate. After filling an SOD film in the trench, a heat treatment is carried out. Part of the liner film in contact with the SOD film is removed to expose part of the SOD film. A heat treatment is carried out on the SOD film. An isolating region is formed by filling an insulating film in the trench.

Abstract(Chinese):

在半导体衬底中的沟槽的内壁上形成氧化膜和衬垫膜。在沟槽中填充SOD膜之后，进行热处理。除去与SOD膜接触的一部分衬垫膜以露出部分SOD膜。对SOD膜进行热处理。通过在沟槽中填充绝缘膜形成隔离区域。

Public/Granted literature

US20100022069A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2010-01-28

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/71	..限定在组H01L21／70中的器件的特殊部件的制造（H01L21/28，H01L21/44，H01L21/48优先）
H01L21/76	...组件间隔离区的制作
H01L21/762	....介电区