Invention Grant
- Patent Title: Process for epitaxially growing epitaxial material regions
- Patent Title (中): 用于外延生长外延材料区的方法
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Application No.: US13004201Application Date: 2011-01-11
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Publication No.: US08173524B1Publication Date: 2012-05-08
- Inventor: Ashima B. Chakravarti , Anthony I. Chou , Abhishek Dube , Dominic J. Schepis
- Applicant: Ashima B. Chakravarti , Anthony I. Chou , Abhishek Dube , Dominic J. Schepis
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb I.P. Law Firm, LLC
- Agent Yuanmin Cai, Esq.
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36

Abstract:
Methods form epitaxial materials by forming at least two gate stacks on a silicon substrate and forming sidewall spacers on sides of the gate stacks. Such methods pattern a recess in the silicon substrate between adjacent ones of the gate stacks. The methods also provide a liner in a bottom of the recess, and epitaxially grow epitaxial material from sidewalls of the recess to fill the recess with the epitaxial material.
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