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US08173524B1 Process for epitaxially growing epitaxial material regions 有权
用于外延生长外延材料区的方法

Process for epitaxially growing epitaxial material regions
Abstract:
Methods form epitaxial materials by forming at least two gate stacks on a silicon substrate and forming sidewall spacers on sides of the gate stacks. Such methods pattern a recess in the silicon substrate between adjacent ones of the gate stacks. The methods also provide a liner in a bottom of the recess, and epitaxially grow epitaxial material from sidewalls of the recess to fill the recess with the epitaxial material.
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