Invention Grant
US08173534B2 Method for producing a semiconductor wafer with rear side identification
有权
用于制造具有背面识别的半导体晶片的方法
- Patent Title: Method for producing a semiconductor wafer with rear side identification
- Patent Title (中): 用于制造具有背面识别的半导体晶片的方法
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Application No.: US13036669Application Date: 2011-02-28
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Publication No.: US08173534B2Publication Date: 2012-05-08
- Inventor: Stephan Bradl , Rainer Holmer
- Applicant: Stephan Bradl , Rainer Holmer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102006001601 20060111
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A semiconductor wafer with rear side identification and to a method for producing the same is disclosed. In one embodiment, the rear side identification has a multiplicity of information regarding the monocrystalline and surface and also rear side constitution. A multiplicity of semiconductor device positions arranged in rows and columns are provided on the top side of the semiconductor wafer, an information chip being arranged at an exposed semiconductor device position, the information chip having at least the information of the rear side identification.
Public/Granted literature
- US20110147471A1 METHOD FOR PRODUCING A SEMICONDUCTOR WAFER WITH REAR SIDE IDENTIFICATION Public/Granted day:2011-06-23
Information query
IPC分类:
