Invention Grant
- Patent Title: Methods of forming silicide regions and resulting MOS devices
- Patent Title (中): 形成硅化物区域和所得MOS器件的方法
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Application No.: US12904809Application Date: 2010-10-14
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Publication No.: US08173540B2Publication Date: 2012-05-08
- Inventor: Tan-Chen Lee , Bor-Wen Chan
- Applicant: Tan-Chen Lee , Bor-Wen Chan
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/4763
- IPC: H01L21/4763

Abstract:
A semiconductor device with improved roll-off resistivity and reliability are provided. The semiconductor device includes a gate dielectric overlying a semiconductor substrate, a gate electrode overlying the gate dielectric, a gate silicide region on the gate electrode, a source/drain region adjacent the gate dielectric, and a source/drain silicide region on the source/drain region, wherein the source/drain silicide region and the gate silicide region have different metal compositions.
Public/Granted literature
- US20110027958A1 Methods of Forming Silicide Regions and Resulting MOS Devices Public/Granted day:2011-02-03
Information query
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