Invention Grant
- Patent Title: Expanded styrene polymers having a reduced thermal conductivity
- Patent Title (中): 具有降低的热导率的膨胀苯乙烯聚合物
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Application No.: US11629776Application Date: 2005-06-09
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Publication No.: US08173714B2Publication Date: 2012-05-08
- Inventor: Achim Datko , Klaus Hahn , Markus Allmendinger
- Applicant: Achim Datko , Klaus Hahn , Markus Allmendinger
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Connolly Bove Lodge & Hutz LLP
- Priority: DE102004028768 20040616
- International Application: PCT/EP2005/006200 WO 20050609
- International Announcement: WO2005/123816 WO 20051229
- Main IPC: C08J9/00
- IPC: C08J9/00
Abstract:
Expanded styrene polymers which have a density of less than 25 g/l and a thermal conductivity λ, determined at 10° C. in accordance with DIN 52612, of less than 32 mW/m*K, and also a process for producing them.
Public/Granted literature
- US20070142488A1 Expanded styrene polymers having a reduced thermal conductivity Public/Granted day:2007-06-21
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